Decided to give the practical aspect of this project a rest for a while.
I have been doing some reading from the excellent “Jewellery Concepts and Technology” by Oppi Untracht (Robert Hale, London, 1982), particularly Chapter 16 “Metallic Buildup – Electrolytic Molecular Creation of Surface and Form”.
It’s got about 40 pages of detailed info about all aspects of electroforming and electroplating, including this recipe:
Typical Acid Copper Plating Bath
- Copper Sulphate (26-33 ounces per gallon)
- Sulphuric Acid (4-10 ounces per gallon)
- Current Density (20-40 amps/square foot)
- Voltage (6)
- Temperature (21-48 centigrade)
- Anode (copper)
Experiment to be continued in November!